electronic equipment
Wafer Lamination

P200 W Series is a full-automatic flat press system able to laminate wafers of different dimensions and thickness for high performance die attach applications.

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Wafer Lamination products

Wafer Lamination Technology

P200 W Series is a full-automatic flat press system able to laminate wafers of different dimensions and thickness for high performance die attach applications. It guarantees flexibility and accuracy during the production process. Fast changeover capability and easy maintenance. It has Iot-ready hardware and advanced software with intuitive interface and complete traceability.
X-Wafer P200 W Series

X-Wafer P200 W Series

X-Wafer P200 W Series

Full in-line Wafer Lamination technology.

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X-Sinter P55

X-Sinter P55

X-Sinter P55

X Sinter P55 is R&D semi auto solution.

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Our patented technology

Discover AMX Automatrix Micro-Punch System

Discover AMX Automatrix Micro-Punch System

AMX Automatrix worldwide patented a unique sintering tool for its sintering press, the ‘Micro-Punch’ able to press individually and with a dedicated pressure every single component on the substrate.

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Discover AMX Automatrix Micro-Punch System
Clean Room & Prototyping
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