X Sinter P55 is R&D semi auto solution.

Larger tool allows to pressure sinter dies on single substrate, as entire mastercard or frame.
It is possible to modulate the clamping stroke to pressure sinter thicker components like already molded packages on pin-fin heatsink.

P55 has a wide range of forces and are able to provide best accuracy both with low and high force.
Thanks to the wafer level tool it is also possible to process entire wafers up to 12’’ø.

Temperature and pressure profile curves can be easily exported by USB.