A high trending process

Core application involving the bonding of SiC/IGBT/MOSFET dies to substrates (DBC or AMB). It supports the simultaneous sintering of diverse components (e.g., NTC thermistors, IGBR resistors, clips, spacers, and pillars) within a single production cycle.

Clip sintering, Cu foil and other component on top of die top side.

Forming complex multi-layered 3D structures where the entire package, including the dies, sensors, frames, and the second DBC on top, is sintered to optimize bi-directional heat dissipation.

An AMX innovative process

Used in front-end, mid-end, and back-end processes, enabling high-performance and significantly improving time to market.